Character LCD Modules packaging process description

1 chip test
Microscopy: the material surface for mechanical damage and pitting Ma Hang (lockhill)
Chip size and the size of the electrode meets the technical requirements
Electrode pattern is complete
(2) expansion of tablets
Since the LED chip dicing still tightly packed closely spaced (about 0.1mm), is not conducive to the process after the operation. We use a tablet machine to expand a membrane expansion chip bonding, the LED chip spacing stretched to about 0.6mm. You can also use manual expansion, but it is likely to cause problems of poor and waste chips fall.
3 Dispensing
The corresponding position in the LED bracket point silver plastic or rubber insulation. (For GaAs, SiC conductive substrate, a back electrode red, yellow, green chips, using silver paste for an insulating substrate of sapphire blue, green LED chips, using an insulating adhesive to fix the chip.)
Difficulty lies in the dispensing process control of the amount, in colloidal height, dispensing location are detailed process requirements.
Because silver plastic and rubber insulation in the storage and use are strict requirements, silver plastic wake materials, mixing, use of time is craft must pay attention to. 20x4 lcd display
4 AVAILABLE glue
And dispensing the contrary, prepare gum is prepared Melter first silver plastic coated electrode on the back of the LED, and then put back with a silver plastic of the LED in the LED mounting bracket. Prepare glue dispensing efficiency is much higher than, but not all products are prepared for dispensing process.
5 piece hand-thorn
After the expansion of the LED chip (prepared or not prepared adhesive glue) placed in the thorn piece desk fixture, LED fixture bracket on the bottom, under the microscope with a pin to an LED chip a stab to the appropriate position. Manual and automatic loading rack barbed piece compared to a benefit for ready replacement of different chips, chips for a variety of products that need to be installed.
6 automatic mounting bracket
Automatic loading rack is actually a combination of glue stick (dispensing) and mounting the chip two steps, the first point in the LED bracket silver plastic (plastic insulation), and then use a vacuum suction nozzle from the LED chip mobile location, and then placed in the corresponding bracket position.
Automatic loading rack in the process should be familiar with the main programming device operation, while dipping equipment and installation precision adjustment. The selection of the nozzle try to use bakelite nozzle, to prevent damage to the surface of the LED chip, especially blue, green chips must be bakelite. Because steel mouth will scratch the surface of the chip current spreading layer. lcd module
7 sintering
The purpose is to sinter the silver plastic curing, sintering temperature required to monitor and prevent adverse batch.
Silver plastic sintering temperature is controlled at 150 ℃, sintering time 2 hours. According to the actual situation can be adjusted to 170 ℃, 1 hr.
Plastic insulation generally 150 ℃, 1 hr.
Silver plastic sintering oven according to process requirements must be separated 2 hours (or 1 hour) open replace sintered products, intermediate can not be opened. Sintering oven must not be any other purpose, to prevent contamination.