And Character LCD Modules driver chip connection principle

ACF (anisotropic conductive film) is a thermosetting resin, are distributed inside a conductive ball, when the ball end of the gold electrodes and leads will be squeezed conductivity, COG type of module is to use this method connection, it has the advantage of the process time is very short. Graphic LCD Module
And compare another way, another technique is affixed help COF Au-Sn eutectic solder film covering the chip electrodes on the FPC by heating, and the bump electrode on the IC eutectic with gold, a metal, and between the chip and the tin film fill the gap of the filler in the future, this method has a fine pitch on a potential advantage, it is ACF mode can not be solved, but there is not realistic, in the production of a lot of disadvantages, for example, require a longer period of contact, temperature, and necessary fillers, etc., produced in the past used this technique when TAB.
All with gold electrodes of the LCD driver can use this technique to make COF.
COF connection
Since the contact surface can be plated COF, behind it and can be isolated PI, which can be made to any available COF FPC contact manner, for example, with enhanced pull-type socket with the FPC can be used, two contact surfaces can be soldered to the PCB fine, in addition there is a hollow electrode contact mode, use can also be soldered directly to the PCB, but this way the impact of raw materials, but also for domestic manufacturers generally not this.
As an integrated micro semiconductor material (Driver + character ROM + active devices) poured directly soldered on COF, which can withstand SMT reflow soldering process, so that some of the capacitors, resistors can be mounted on to the COF. COG LCD Display