System using a long bar melt pump (Fusion Pump), the molten glass paste transported to the center of the melt pump, and then use the overflow way, the two stocks out of overflow glass paste on the pump at the bottom and then combined into a thin sheet glass. lcd graphic display
With this mold molding technology also need to draw on, and thus also faces melt pump mold deformation due to mechanical stress, melt pump to maintain the level of degree, and how stable the molten glass into molten cream pump in question. Because the use of overflow fusion method of molding technology made into a super-flat glass, the thickness of the glass surface is determined by the quality of transport to the molten glass paste volume pump, stability, level of degree, the surface properties of the pump and glass leads to volume.
Melt overflow technique can produce double the original glass surface with ultra-thin glass substrate, compared to float method (only outputs a single original glass surface) and down-flow orifice (not output the original glass surface), eliminates the grinding or polishing processes such as post-processing, while the flat panel display manufacturing process, nor do they need to pay attention, both the original and in contact with the liquid tin different glass surface, or the contact and the grinding media have caused differences in the surface properties of glass and so on, has become a mainstream thin flat glass molding.
Since E-glass has a special ingredient in the formulation and thermal stability, mechanical, electrical, optical, chemical and other characteristics and appearance of size, surface roughness, and other aspects very strict standards, so the production line adjustment, learning a long time, To join the new party industry technical threshold is high. custom lcd module
OLED Module technology and development with echoes, OLED drive also plays an increasingly important role. Not only from the low duty cycle increases to support high duty cycle, and the application of such a control current for each RGB, wider IC operating temperature (-45 to 80 ℃), the internal DC-DC boost, as well as graphics acceleration instruction and some other features.
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