As early as 1999, the low-temperature polysilicon Tsingtek low temperature lcd display has been around , so it is far from what the new technology . However, due to various reasons, the slow development of low-temperature polysilicon technology , and even stay long in words, until the recent breakthrough in the field appears to be outside again before starting to pay attention . Low-temperature polysilicon stands for "Low Temperature Poly-Silicon (LTPS, polysilicon is also known as the p-Si, the same below ) ," which is a branch of polysilicon technology. On the lcd graphic display modules monitor , the adoption of polysilicon liquid crystal material has many advantages , such as thin-film circuits can be made thinner and smaller , lower power consumption and so on , we will focus on the following . However, in the early development of polysilicon technology , in order to transition from the amorphous glass substrate structure (a-Si) is a polycrystalline structure, it must use a laser annealing (Laser Anneal) high-temperature oxidation step , when the temperature exceeds the glass substrate graphic lcd display module . Known, ordinary glass softens at this high temperature melting , can not work properly , and only the silica glass to be able to withstand such high temperature processing . The quartz glass is not only expensive and sizes are smaller , not as a display panel makers naturally chose the cheap amorphous material (a-Si), which is the situation we see today. However, the industry has not given up efforts to develop low-temperature polysilicon technology become the consensus , after years of effort, low-temperature polysilicon finally step into reality. Compared with the conventional high temperature polysilicon , low temperature polysilicon although laser irradiation step needs , but it is used as a heat source is an excimer laser , the laser transmission through the system will produce a uniform distribution of the laser beam energy in the amorphous structure and projected on a glass substrate when the glass substrate is an amorphous silicon structure of the energy absorption of the excimer laser , the structure will be transformed into polycrystalline silicon . Since the entire process is completed in less 500-600 ° C , conventional glass substrate can withstand , which greatly reduces the manufacturing cost , the polysilicon LCD technology into the display area also feasible .
OLED Module technology and development with echoes, OLED drive also plays an increasingly important role. Not only from the low duty cycle increases to support high duty cycle, and the application of such a control current for each RGB, wider IC operating temperature (-45 to 80 ℃), the internal DC-DC boost, as well as graphics acceleration instruction and some other features.
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